Semiconductors

Riverside, California – January 3, 2017 – Bourns is pleased to announce the release of the Model AA Series Miniature Resettable Thermal Cutoff (TCO) devices. The Model AA Series effectively delivers higher current overtemperature protection to make newer battery designs … Read More

Quectel, a leading global supplier of M2M modules, announces the launch of its new GNSS Module L76-L. Integrated a built-in LNA (Low-Noise Amplifier) with GNSS receiver, L76-L offers improved RF sensitivity and has exceptional performance both in acquisition and tracking … Read More

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced qualification of its AEC-Q100 grade 1 automotive-grade field programmable gate arrays (FPGAs). In addition to outlining the criterion for electronic components to ensure … Read More

If you are looking for a SoC solution (System on Chip) for applications where is requested a GPRS connection data, the answer is in the new M66 Quectel module. M66 is just 17,7mm x 15,8mm (The Smallest GSM/GPRS module on the … Read More

FTDI is delighted to announce the production release of their FT260 IC. Enhancing FTDI’s portfolio of USB bridge solutions, the FT260 offers a new era in easy bridging of different protocols to USB. Operating as a HID (Human Interface Device) … Read More

The new 20 watt DC-DC converter features an extra wide input of 4:1 and is housed in a miniature 1×1 inch package.